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Filtragem por: Contribuinte Green, Todd Encontro 2019

1. Copper and tin electrodeposition from deep eutectic solvents using pulse current

O Criador:: Su, Xiaomeng
Encontro:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering

2. Effect of water on copper electrodeposition from water-containing deep eutectic solvents

O Criador:: Valverde Armas, Priscila Estefania
Encontro:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering