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Filtro per: Collaboratore Green, Todd Data 2019 Dipartimento, Scuola o Facoltà Department of Chemical and Process Engineering

1. Copper and tin electrodeposition from deep eutectic solvents using pulse current

Creatore:: Su, Xiaomeng
Data:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering

2. Effect of water on copper electrodeposition from water-containing deep eutectic solvents

Creatore:: Valverde Armas, Priscila Estefania
Data:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering