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1. Electrochemical deposition and dissolution of nickel from electroforming solutions

Schöpfer:: Tambe, Christine Enowmbi
Datum:: 2023
Department, School or Faculty:: Department of Chemical and Process Engineering

2. Copper and tin electrodeposition from deep eutectic solvents using pulse current

Schöpfer:: Su, Xiaomeng
Datum:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering

3. Effect of water on copper electrodeposition from water-containing deep eutectic solvents

Schöpfer:: Valverde Armas, Priscila Estefania
Datum:: 2019
Department, School or Faculty:: Department of Chemical and Process Engineering