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Filtrado por: Contribuyente Green, Todd Tipo de recurso http://purl.org/coar/resource_type/c_db06

Electrochemical deposition and dissolution of nickel from electroforming solutions

Creador:

Tambe, Christine Enowmbi

Fecha:

2023

Department, School or Faculty:

Department of Chemical and Process Engineering
Copper and tin electrodeposition from deep eutectic solvents using pulse current

Creador:

Su, Xiaomeng

Fecha:

2019

Department, School or Faculty:

Department of Chemical and Process Engineering
Effect of water on copper electrodeposition from water-containing deep eutectic solvents

Creador:

Valverde Armas, Priscila Estefania

Fecha:

2019

Department, School or Faculty:

Department of Chemical and Process Engineering