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Green, Todd
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2019
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Copper and tin electrodeposition from deep eutectic solvents using pulse current
Creator:
Su, Xiaomeng
Date:
2019
Department, School or Faculty:
Department of Chemical and Process Engineering
Effect of water on copper electrodeposition from water-containing deep eutectic solvents
Creator:
Valverde Armas, Priscila Estefania
Date:
2019
Department, School or Faculty:
Department of Chemical and Process Engineering
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Doctoral thesis
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Creator
Su, Xiaomeng
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Valverde Armas, Priscila Estefania
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Contributor
Green, Todd
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Roy, Sudipta
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Department, School or Faculty
Department of Chemical and Process Engineering
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Date
2019
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